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FTIR Services in the Electronics Failure Analysis Lab

Spirit Electronics offers Fourier Transform InfraRed spectroscopy, or FTIR services when performing root cause analysis on the failure of an electronic component. What is Fourier Transform Infrared? Fourier Transform Infrared
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Semiconductor Failure Analysis Techniques

Semiconductor Failure Analysis – Enhancing Reliability Semiconductor failure analysis occupies a prominent position among high-tech fabricators. Even the most sophisticated ICs fail, and when they do, it’s critical that engineers
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Common Types of IC Defects and Failures

Every IC defects and failures analysis project is unique; rarely, if ever, will an analyst come across a defect that is exactly identical to one found on a previous project.
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Avoid Electronic Failures with (EDS) Energy Dispersive Spectroscopy

Energy Dispersive Spectroscopy is like getting a fingerprint on your electronic component failure root cause. So you’re having a problem with a printed circuit board assembly (PCBA). You’ve done all
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Microelectronics X-Ray Imaging – Seeing Through to the Root of Failure

Microelectronics X-Ray imaging allows an analyst to see the inner workings of a device without disturbing its physical integrity. What is Microelectronics X-Ray Imaging Most modern electronic devices are packaged
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Using FIB for Wafer Lot Acceptance and Design Verification

In this post, you will learn how an electronics failure analysis lab uses a FIB for Wafer Lot Acceptance during design verification. In the current era of System-on-Chip (SoC) designs with 10
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