Precision BGA Reball

Solder ball exchange with automated technology for high-reliability solutions

Spirit’s proprietary automated BGA ball removal process

Spirit’s automated technology safeguards your BGA from ball removal to final inspection.

Reball BGAs from lead-free to tin-lead conversion. Meet industry requirements for lead (Pb) composition. Convert an OEM Lead Free (SAC305) solder ball to tin lead solder ball (63/37) for better solder bonding and resilient performance under thermal stress.

How Many Balls Can You Place? Speed with Automation and Precision

Capable of placing 45,000 balls per hour, our line can handle high-ball-count FPGAs and ultra-small solder balls for high-volume reball. Our automation allows for high-speed production with precision that protects your product’s performance.

Automated Optical Inspection (AOI) Every Step of the Way

The same automated technology used in the final ball scan inspects balls and arrays during printing, ball placement, and before reflow
Laser automation and true-color 12 megapixel camera inspect balls and arrays.
Precision AOI can even inspect for warpage of the BGA substrate.
AOI identifies issues during pick-and-place and will automatically sort and replace missing or damaged balls before the array leaves the assembly line.
Programmed auto-sort will identify damaged solder balls and reject them before they are placed.
Avoid rework and line delays.

Our Reball Process

I. Robotic Ball Removal

Ball removal with robotic precision
Fountain dip for controlled application of flux to solder balls
Heat blower activates the flux
Robotic pass across a hot solder wave detaches old solder balls
Automated removal protects the BGA terminals from damage common with mechanical and manual methods

II. Solder Paste Printing

Stencil controls solder paste application to each pad on the BGA
Single-swing squeegee head applies paste with exact thickness in one swipe
2D inspection verifies stencil alignment and paste thickness

III. Ball Pick-and-Placement

Solder ball placement using 10-head vacuum
Places new, leaded solder balls precisely on the BGA pads
Self-clearing nozzles capable of picking up <0.5 mm solder balls

IV. 10-Zone Oven Reflow

Robust temperature control heats solder paste to achieve reflow and bond solder balls to pads
KIC software fine tunes oven profile to prevent over- or under-exposure to heat

V. Deionized Wash

Closed-loop deionized water system removes any remaining paste
Wash is controlled for temperature and conveyor speed
ESD protection

VI. Final Ball Scan

Automated optical inspection checks all BGAs for:
i. Diameter
ii. Spacing
iii. Pitch
iv. Missing balls
v. Damage
vi. Location
Rejected BGAs are auto-sorted to remove them from the line and identify the issue down to the individual ball.

VII. XRF and SAM Inspection

Verify ball composition with XRF analysis to guarantee leaded solutions meet requirements
Non-invasive inspection of BGA connections and materials with sonic acoustic microscopy (SAM)

Spirit's in-house services deliver your device as close to production-ready as you can get, while it never leaves our care and custody:

Authorized Distribution and BOM Management
- Spirit can purchase your BGAs from our industry-leading authorized manufacturers
Electrical Testing
- Verify the performance integrity of your BGAs
Board assembly
- Place reballed BGAs to your board along with the rest of your bill of materials and receive your board ready-to-use

Industry Standards:

J-STD-001
J-STD-004
J-STD-006
J-STD-033
IEC/TS62647
IPC-7711/7721
GEIA-STD-0006
ANSI/ESD S20.20 and JESD625 for ESD Control
AS9100 Quality Management for Process Controls

Contact our team today to get a quote on your BGA reball project.