Microelectronics Analytical Lab

Today’s semiconductors and electronic devices are in a constant state of evolution. With this evolution comes ever-increasing complexity in both manufacturing and analysis. To address this reality, Spirit maintains a comprehensive set of analytical tools and techniques both in-house at our facility and through a network of highly qualified partner labs.

Our Capabilities

Initial inspections often utilize a number of non-destructive techniques including:

  • X-ray Inspection, 2-D Real-Time, and 3-D*
  • Scanning Acoustic Microscopy Services (including c-mode scanning)
  • Optical Inspection (Dark Field, Bright Field, Polarized, High-Resolution Mosaic Functionality)
  • Electrical Test Equipment
  • Infrared (IR) Microscopy
  • X-ray Fluorescence (XRF)
  • Fourier Transform Infrared (FTIR)
  • Energy Dispersive Spectroscopy (EDS)
  • Hi-pot and Insulation Resistance Testing

Deep dive failure analysis requires a variety of more invasive or destructive techniques, including:

  • Dual-Beam FIB
  • Cross Sectioning of ICs and PCBs (Mechanical and FIB)
  • FIB Editing*
  • Scanning Electron Microscopy Lab (SEM and FE-SEM)
  • IC Deprocessing, including:
    • Parallel Lapping
    • Dry and Wet Etching
    • Reactive Ion Etching
  • STEM Prep and Imaging
  • Dye and Pry (BGA devices)
  • Decapping and depotting (ICs)
  • Solderability Analysis

For fault isolation, Spirit relies on a variety of techniques, including:

  • Photo Emission Microscopy (PEM)
  • Liquid Crystal Analysis
  • LIVA/TIVA Analysis
  • Thermal Imaging
  • Electrical Probing