Robotic Hot Solder Dip Services for Military, Defense, and Space Solutions
Spirit’s automated lab technology provides a variety of hot solder dip services to safeguard products against environmental and oxidation issues, without damaging the original component. Our laboratory team can control all aspects of the process as dictated by the customer.
Our hot solder dip services are performed according to GEIA-STD-0006 and J-STD-001 standards. Convert a standard finish to a variety of compositions for better solder bonding and resilient performance under thermal stress. We offer gold and tin mitigation, as well as pre-tinning services.
Spirit Robotic Hot Solder Dip is specialized to provide the following services:
- Tin Whisker Mitigation – Spirit’s process removes 100% of the pure tin and replaces it with SnPb to prevent tin whiskers. Processed according to GEIA-STD-0006.
- Gold Mitigation per J-STD-001 – Tinning gold in the seating plane and replacing it with SnPb.
- Refinishes with Tin/Lead, Lead-free, and Custom Solder for a variety of applications and requirements according to the customer’s needs.
- Solderability Refurbishment – Correcting finished impacted by poor plating or oxidation.
- Lead-Free Solder Weakness Prevention. Replacing a potentially weak solder joint by replacing a lead-free termination with a tin-lead (63/37), tin-silver-copper (SAC305), or custom alloy.
Our HSD services delivery your device as close to production-ready as possible, safeguarded by Spirit’s high-touch care and expertise.
Contact our team today for a quote on your HSD project.
Industry Standards:
- J-STD-001
- J-STD-004
- J-STD-006
- J-STD-033
- IPC-7711/7721
- GEIA-STD-0006
- ANSI/ESD S20.20 and JESD625 for ESD Control
- AS9100 Quality Management for Process Controls
