Wafer test and sort is the step between front-end fabrication and everything that follows — packaging, assembly, and final qualification — where each die on a wafer is probed and measured before any of it is diced, since process variation across a wafer means die from the same design can still differ in speed, leakage, or basic pass/fail status, and catching that on an intact wafer is far cheaper than discovering it after packaging. Probe testing collects that data die by die through direct contact with each die’s bond pads, capturing functional and parametric (AC/DC) performance that then drives binning — sorting die into performance tiers so each one is matched to the application it’s actually suited for, which matters most in die stacking and multi-chip designs where “Known Good Die” status has to be verified before assembly rather than discovered after it. For mission-critical and harsh-environment applications, that testing typically runs across multiple temperatures rather than a single condition, since military, aerospace, and space deployments rarely operate at a stable room temperature. Below are the specific wafer test capabilities and wire bonding processes Spirit supports as part of that post-foundry flow.