Page 6 – Spirit Electronics

Ep. 46: Spirit Gives: Basket Gifting Fundraiser

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Ep. 46: Spirit Gives: Basket Gifting Fundraiser

In this bonus episode, Marti & Alyssa talk about the ongoing Spirit Gives Foundation basket fundraiser. Donations allow us to hold community building events and support local children year-round.

Spirit Gives has the perfect gift for your spring holiday. Whether it’s Easter, Mother’s Day, Father’s Day, graduation, teacher appreciation or your own special occasion, Spirit Gives is offering high-end pampering gifts baskets in appreciation for donations. You can preview baskets and donate today at SpiritGives.org.

Advancing Aerospace & Defense Applications with the AMD Xilinx Versal ACAP

AMD Xilinx Versal ACAP @ Spirit Electronics

AMD Xilinx rolled out the first Adaptive Compute Acceleration Platform (ACAP) device in 2021. The high-reliability XQR and XQ Versal devices released in 2022 are qualified and ruggedized for military and aerospace applications, onboard computing and data processing is accelerating just when commercial space, low-Earth orbit missions, and New Space are booming.

With the speed of advancement in the A&D industry, adoption can be a challenge. Design, qualification and supporting technology can be important factors in taking advantage of a device with capabilities as intensive as the Versal.

What Can ACAP Do in A&D?

The Versal ACAP offers programmable logic capabilities beyond the FPGA. Where the FPGA required more hardware programming, the Versal platform allows for more advanced reconfiguration by incorporating artificial intelligence and machine learning. This increases computing power and flexibility while in orbit or in ops, allowing computing to adapt to mission needs.

Applications for satellite and commercial space missions include cloud and internet connectivity, high-speed networking, and greater data processing and control for radar, GPS and instrumentation. In-flight programming opens a wide range of possibilities for reconfiguration across the life of the mission.

Applied on ground and air defense operations, the Versal is optimized for sensor systems, networking, wireless data processing, and radar applications. Adaptable AI features allow reprogramming to adjust to new and evolving algorithms.

Versal Qualification for Defense

The XQ Versal uses ruggedized packaging options to protect device operations in harsh and high-reliability operations. AMD Xilinx has over 30 years of heritage in military and defense support, and the new XQ Versal includes design considerations unique to the industry.

The defense-grade Versal comes with MIL-STD-883 Group D qualification testing, with extended temperature range from –55°C to +125°C. Packaging meets MIL-PRF-38535 requirements for tin-lead (3% Pb) to protect solder from whiskering.

The XQ Versal package design also considers ease of assembly where military and defense applications often require conformal coating to protect the assembled board. The open-lid package is unique to the XQ Versal to simplify board assembly and prevent manufacturing chemicals from being trapped in the device before sealing.

AMD Xilinx includes anti-counterfeit laser marking, micro watermarking and 2D bar coding to advance supply chain security for Versal devices.

Versal Qualification for Space and New Space

The XQR Versal is radiation tolerant, ideal for low-Earth orbit environments common among satellite and commercial space programs. It is capable of supporting 5- to 7-year missions, allowing in-orbit reconfiguration and programming throughout the mission life. The XQR Versal is radiation tolerant to MIL-STD-883 Class B.

Ecosystem of Products to Support the Versal ACAP

The new ACAP approach to in-flight computing requires power, memory and an ecosystem of advanced components supporting the Versal. Spirit Electronics brings the best technical support in the business from our advanced OCMs to make sure your board design can support the Versal.

- The Versal ACAP comes with a hardened integrated DDR Memory Controller (DDRMC) and includes programmable network on chip (NOC) for advanced interconnectivity. Performing inside the board ecosystem, any additional memory supporting the Versal must be DDR4 or more advanced memory. Spirit offers space-qualified DDR4 memory capable of supporting the Versal.

- Texas Instruments power management ICs support the Versal’s higher-current processor loads. TI’s flight heritage also offers power management with rad-hard and rad-tolerant qualifications for components ready to fly space and harsh-environment missions.

The ACAP Moves A&D Forward

Building on the FPGA’s programmable logic and customizable applications, the Versal ACAP brings computing into the next evolution of AI and machine learning integration for faster, connected processing. As the volume of data in New Space and defense applications grows, the ACAP offers advanced processing to manage, communicate and adapt to demanding missions. With in-ops advanced reprogramming capabilities, the Versal ACAP extends mission life and success for aerospace and defense applications.

Improving Computing with Advanced Device Architecture

The 7nm Versal ACAP is fully programmable heterogeneous computing using Scalar, Adaptable, and Intelligent Engines that improve on previous AMD Xilinx FPGA and SoC devices for the highest- and fastest-performing programmable logic.

XQ Defense-Grade Versal Product Brief

Spirit Electronics Honored by Northrop Grumman for Strategic Excellence

Spirit Account Representative Jason Brandsma and Corporate Sales Manager Dan Jasinek

Spirit Electronics was recently recognized as a top Northrop Grumman Corporation supplier for 2022 with their Strategic Excellence Award. Spirit earned the honor for providing electronic components and value-added services that support unique and critical business needs for Northrop Grumman and its customers with outstanding service.

“I’m very proud of the partnership the Spirit team has grown with Northrop Grumman,” says Spirit Electronics CEO Marti McCurdy. “Spirit offers a vertically integrated approach to the supply chain, which is why we are able to offer such strategic support to our customers’ advanced programs.”

Spirit was one of only 24 honorees to receive the Strategic Excellence Award from among Northrop Grumman’s 10,000 global suppliers. This is the second year running for Spirit’s recognition in Northrop Grumman’s supplier awards. Spirit was named a World Class Team Supplier in 2021.

“The performance of Spirit Electronics sets it apart as one of the best of the best supplier partners,” said Matt Bromberg, Corporate Vice President, Global Operations Northrop Grumman. “The expertise and partnership of our supplier teams across the globe demonstrates that together, we are well positioned to meet our customers’ most complex mission needs.”

Spirit Electronics offers strategic supply chain solutions for aerospace and defense customers. Spirit’s products and services include authorized component distribution, MIL-STD-883 testing and qualification, and automated circuit card assembly. Bringing distribution and services in-house under a single supply source allows Spirit to streamline, secure and manage multiple aspects of the supply chain for customers like Northrop Grumman.

Intelligent Memory Added to Spirit Linecard

Intelligent Memory high-mix, low-volume DDR, DRAM and NAND flash now at Spirit Electronics

Spirit Electronics announces authorized distribution for Intelligent Memory high-mix low-volume DDR, DRAM and NAND flash memory components. IM memory is especially important to aerospace and defense customers as a form, fit and function drop-in replacement for obsoleted or end-of-life products of other memory manufacturers.

With a focus on ruggedized, industrial and legacy requirements, IM offers flexible and reliable memory options that can be customized to unique applications and challenging environments.

Intelligent Memory is positioned as a one-stop-shop memory supplier, complementing Spirit’s business model as a one-stop distribution, test and assembly company within the aerospace and defense supply chain. “We share the same approach to delivering reliable and ready-to-launch solutions for our customers,” Spirit CEO Marti McCurdy explains. “Intelligent Memory expands our memory offering to meet the exact size, speed, temperature and performance our customer programs require.”

Intelligent Memory is a fabless memory manufacturer owning design, development, test and manufacturing of unique DRAM components and modules. The brand works with tier-one fabricators and in-house design, testing and quality controls. All IM products are JEDEC compliant, and Spirit’s in-house screening and qualification can elevate product data and reliability to meet strict military standard and aerospace requirements.

As space and defense programs expand to meet faster production timelines, Spirit has seen particular supply chain needs around DDR memory and programs that depend on legacy memory or struggle to replace obsolete memory products. IM memory offers a variety of configurations, densities, features and packaging, including the first DDR3 8GB single-chip component. Many IM products are backwards compatible with those of other memory manufacturers.

Spirit Electronics offers Intelligent Memory alongside a comprehensive linecard of authorized industry-leading components, including FPGAs and other integrated circuits. In addition to distribution, Spirit provides MIL-STD-883 testing, radiation testing, solder exchange and circuit card assembly in-house, making it a unique supply chain partner capable of managing complex aerospace program logistics.

About Spirit Electronics:Spirit Electronics is a value-added distributor of a wide range of electronic components, testing, circuit board assembly and logistics services. Spirit’s supply chain solutions are changing the definition of distribution by providing in-house value-added services to deliver products to aerospace and defense customers fully qualified and ready to use. Spirit is a veteran-owned, woman-owned small business (VOWOSB) with HUBZone certification in Phoenix, AZ.

Lockheed Martin Space Outstanding Small Business for 2022

Lockheed Martin Outstanding Small Business 2022

Spirit Electronics is proud to announce its selection as an Outstanding Small Business for Lockheed Martin’s Space division for 2022. One of only five suppliers in the country to receive the award, Spirit achieved 100% on-time-delivery and 99.45% quality scores. Spirit provides Lockheed Martin Space with authorized distribution and full-turnkey test and assembly for microelectronics and semiconductors.

The Lockheed Space division estimates it will spend approximately $5.4 billion in 2022 with small businesses, generating economic growth and taking advantage of small business strengths in innovation and agility. Lockheed Martin Space’s Orion program alone includes 2,900 suppliers, with approximately 50% being small businesses like Spirit.

“This is truly a team effort to win service awards and recognition from our customers,” says Spirit CEO Marti McCurdy. “From our dedicated account representatives to our sales and purchasing, our warehouse inspectors, our lab, our quality and even admin teams, everyone at Spirit pours excellence into their work. It shows in our processes, customer satisfaction and relationships.”

Spirit is a woman-owned, veteran-owned and HUBZone certified small business. In the past 5 years, the team has grown from under ten to more than thirty employees. Spirit purchased and renovated a 16,000sf facility in a historically underutilized business zone in Phoenix in 2019. Spirit expanded from its roots as an authorized microelectronics and semiconductor distributor to offer MIL-STD-883 testing services, BGA solder exchange and an in-house circuit board assembly line.

“This team truly embodies the tenacity and personal service of a small business,” says McCurdy. “We are on a mission to redefine the supply chain by bringing multiple services and efficiency under one supplier for our customers, and this award shows we are achieving that with the best quality of service.”

Ep. 45: ASIC Dive: How to Maximize Time to Market and Program Cost with ASIC Test Programs

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Ep. 45: ASIC Dive: How to Maximize Time to Market and Program Cost with ASIC Test Programs

Zef Malik returns for an ASIC dive discussing the process and benefits to electrical test programs for ASICs. With the design access and knowledge in already part of an ASIC program, testing and qualifying an ASIC can quickly deliver ASIC devices ready-to-use with reliability.

Listen to Zef and Marti discuss:

(2:24) Benchmarking an ASIC

(6:01) The System on a Chip Market

(7:10) How ASIC Electrical Test Fits in the Full-Turnkey Screen & Qual

(11:00) Burn-In, Qualification Challenges, and Simplifying Test Programs

(14:00) Cost Improvement with ASIC Testing and Wafer-Level Test

(16:00) Product Roadmap and the Return of US Manufacturing

Ep. 44: ASIC Dive: Managing Foundry Selection & Packaging to Maximize Your Program Advantage

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Ep. 44: ASIC Dive: Managing Foundry Selection & Packaging to Maximize Your Program Advantage

Spirit VP Zef Malik remembers the early days of the ASIC industry. While the FPGA and international manufacturing moved aerospace and defense away from ASIC programs, Zef sees ASIC programming growing and changing as domestic manufacturing returns.

Listen to Zef and Marti discuss the technological ASIC advantages and how to maximize these benefits through foundry services and packaging selection.

(1:55) ASICs in the Early Years

(4:35) ASIC Design Compatibility & Foundry Selection

(8:25) Silicon Valley Memory Lane & Return to Domestic Design

(12:30) ASICs, Power & Performance Advantages

Semiconductor Failure Analysis Techniques

Semiconductor Failure Analysis – Enhancing Reliability

Semiconductor failure analysis occupies a prominent position among high-tech fabricators. Even the most sophisticated ICs fail, and when they do, it’s critical that engineers and fabricators discover the root causes of the failure, so as to avoid the same issues in subsequent designs.

Semiconductor analysis can, therefore, enhance semiconductor reliability by addressing observed shortcomings in design and fabrication and then avoiding them in the future.

Semiconductor failure analysis initially involves pinpointing the nature of the failure. Semiconductor failures can be broadly grouped into two categories: functional failures and parametric failures. A functional failure means the device failed in its intended function, while parametric failures mean the device’s function lies outside the specifications for a measurable characteristic.

Parametric failures have nothing to do with the intended functionality of the device. The initial phase of semiconductor failure analysis then calls for failure verification in which the failure is identified and categorized.

The next phase of testing seeks to localize the exact origin and causes of the failure. To achieve that goal, semiconductor failure analysis will subject the device to various forms of testing, some non-destructive, and others destructive.

Obviously, one must exercise caution in moving on to the destructive semiconductor failure analysis techniques, as they will render any other forms of testing impracticable. Some of the non-destructive semiconductor failure analysis techniques include optical microscopy, X-ray radiography, curve tracing and hermeticity testing. Destructive techniques include decapsulation, sectioning, microprobing, SIMS, LIMS and chromatography.

Together, these techniques will enable analysts to pinpoint the location and nature of the semiconductor failure. However, care must be taken to compare the results of various semiconductor failure analysis techniques to eliminate faulty conclusions based on conflicting results. Reliable semiconductor failure analysis requires careful examination by skillful engineers and not just the latest equipment.

Ep. 43: Basics of ASICs: How a Multi-Functional ASIC Shortens Lead Times and Secures Your Supply Chain

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Ep. 43: Basics of ASICs: How a Multi-Functional ASIC Shortens Lead Times and Secures Your Supply Chain

Application-specific integrated circuits (ASICs) can combine multi-functional components into a single chip. With long lead times and rising prices across the industry, you can own your custom IC, shorten lead times and reduce long-term costs.

Spirit’s expertise helps you through the up-front design and engineering to make a full ASIC program possible. In this episode, Marti covers the steps and benefits to running an ASIC program.

Hear about:

(1:30) Types of ASICs

(4:57) Engineering & design support

(8:05) Foundry & fabrication

(11:10) Substrate & packaging

(11:50) Testing the full range of an ASIC

(14:05) Storage & banking

Ep. 42: How the CHIPS Act Will Impact Services and Supply Chain Around Semiconductor Manufacturing

Get the inside scoop on industry news and technology!

In this podcast, Spirit Electronics CEO Marti McCurdy talks with aerospace and defense experts about high-reliability components and industry-rocking topics affecting the supply chain.

Ep. 42: How the CHIPS Act Will Impact Services and Supply Chain Around Semiconductor Manufacturing

The CHIPS (“Creating Helpful Incentives to Produce Semiconductors”) Act passed in July authorizes more than $200 billion in federal funds and incentives to encourage semiconductor manufacturing in the United States.

While the main goal is manufacturing, the CHIPS Act also addresses the services, labor and supply chain that support semiconductor production. Spirit CEO Marti McCurdy discusses in this episode what areas of the supply chain could see additional investment and support.

Also critical to supporting semiconductor manufacturing are resources like substrate manufacturing and testing services. Marti discusses how Spirit is positioned to help customers stay ahead of these unexpected constraints.