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TI Foundry Storefront

Foundry Services at Texas Instruments Wafer Fabs

Texas Instruments

TI Foundry Access

Spirit Electronics is now the only TI authorized reseller to offer its customers access to TI’s 300-mm wafer foundries.

Access to TI’s advanced manufacturing and quality fab facilities enables our customers to develop cutting-edge ASICs for critical programs that require US manufacturing.

From application review through design and layout, to prototype fabrication and test program development, Spirit manages your ASIC program at every step — across programs, across divisions.

We offer expert engineering collaboration, critical circuit design for applications and reliable supplier support.

More than just engineering, we’re also production and a whole-service supply chain for ASICs, with innovation, speed and new technologies.

ASIC Production Path

Selecting the right fabrication technology and foundry partner is crucial for achieving the ASIC’s desired performance, power efficiency, and cost targets.  Spirit’s collaboration with TI provides customers a straightforward path to ASIC production, utilizing TI’s analog and mixed-signal technology nodes that remain a cornerstone of aerospace and defense electronics.

Design to Delivery

Spirit will work with customer programs to design an IC, manufacture the wafer at the TI foundry, and then deliver the wafer to Spirit Electronics to perform advanced wafer testing, packaging and qualification. Spirit’s end-to-end service options include circuit card assembly to place the final ASIC product on a printed circuit board for application-ready delivery.

With Spirit’s end-to-end turnkey services, we offer customers complete control of design and production under our umbrella.

TI Foundry Options

Process Technologies

BDC130

Spirit Electronics offers Texas Instruments’ BCD130 family of process technologies that are ideal for power management, analog front end, and applications that require high voltage operation with significant digital density. The BCD130MV includes LDMOS components up to 105V and the BCD130PLV includes LDMOS components up to 40V.

SiGe130

TI’s SiGe130 process is ideal for high-speed communications and RF. The SiGe 130nm process offers superior performance for high-frequency, high-reliability applications in extreme environments. These processes are 5V capable, which makes them ideal for replacing legacy or obsolete ASICs.

65nm CMOS

The 65nm CMOS process is ideal for microcontrollers, offering analog friendly CMOS, high performance, low power consumption, and increased integration of features on a single chip. It supports the availability of embedded Flash and SRAM, enabling versatile storage and faster processing capabilities.

Vertical Integration

Spirit offers end-to-end ASIC services.

  • Design
  • Foundry
  • Wafer probe & binning
  • Wafer processing
  • Package design
  • Assembly
  • Electrical & radiation testing
  • Screening & qualification
  • Device analysis – DPA & FA
  • Delivery of space-grade product

Made in the USA

All design, production, test, assembly and logistics are performed completely by our U.S. teams. We can handle ITAR requirements and regulations.

FPGA to ASIC Conversions

Converting your FPGA to a custom ASIC allows you to own your supply chain. We can replicate an obsolete microprocessor and eliminate EOL and obsolescence issues.

Applications

  • Aerospace
  • Defense
  • Industrial
  • Automotive
  • Medical
  • Security

Device Types:

  • Sensors
  • RF Devices
  • Motion Control Devices
  • Instrumentation / Avionics
  • RFID
  • Monitoring Systems
  • Measurement & Control

Spirit Program Benefits

  • Increased Efficiency
  • Cost Control
  • Schedule Control
  • Leverage Buying
  • No EOL or Obsolescence
  • Competitive Advantages
  • American Made

Digital/ASIC Design

Analog Circuit Design

RF Design

IC Mask Design

Supply Chain Management

Mixed Signal Verification

Lab
Characterization

Design Consulting Services