Foundry Services
Foundry Services at Texas Instruments Wafer Fabs
TI Foundry Access
Spirit Electronics is the only TI authorized foundry access provider to offer access to ALL of TI’s wafer foundries.
Access to TI’s advanced manufacturing and quality fab facilities enables our customers to develop cutting-edge ASICs for critical programs that require US manufacturing.
From application review through design and layout, to prototype fabrication and test program development, Spirit manages your ASIC program at every step — across programs, across divisions.
We offer expert engineering collaboration, critical circuit design for applications and reliable supplier support.
More than just engineering, we’re also production and a whole-service supply chain for ASICs, with innovation, speed and new technologies.
ASIC Production Path
Selecting the right fabrication technology and foundry partner is crucial for achieving the ASIC’s desired performance, power efficiency, and cost targets.  Spirit’s collaboration with TI provides customers a straightforward path to ASIC production, utilizing TI’s analog and mixed-signal technology nodes that remain a cornerstone of aerospace and defense electronics.
Design to Delivery
Spirit will work with customer programs to design an IC, manufacture the wafer at the TI foundry, and then deliver the wafer to Spirit Electronics to perform advanced wafer testing, packaging and qualification. Spirit’s end-to-end service options include circuit card assembly to place the final ASIC product on a printed circuit board for application-ready delivery.
With Spirit’s end-to-end turnkey services, we offer customers complete control of design and production under our umbrella.
TI Foundry Options
Process Technologies
BCD130
Spirit Electronics offers Texas Instruments’ BCD130 family of process technologies that are ideal for power management, analog front end, and applications that require high voltage operation with significant digital density. The BCD130MV includes LDMOS components up to 105V and the BCD130PLV includes LDMOS components up to 40V.
SiGe130
TI’s SiGe130 process is ideal for high-speed communications and RF. The SiGe 130nm process offers superior performance for high-frequency, high-reliability applications in extreme environments. These processes are 5V capable, which makes them ideal for replacing legacy or obsolete ASICs.
65nm CMOS
The 65nm CMOS process is ideal for microcontrollers, offering analog friendly CMOS, high performance, low power consumption, and increased integration of features on a single chip. It supports the availability of embedded Flash and SRAM, enabling versatile storage and faster processing capabilities.
28nm CMOS
28nm CMOS technology represents a critical milestone in semiconductor fabrication, balancing high performance, lower power consumption, and manageable manufacturing complexity. Supporting a wide range of applications, 28nm provides an optimal balance of cost, performance, and power—especially for edge computing and analog/mixed-signal integration.
Advanced Foundry Capabilities
Our foundry services are designed to handle the most complex requirements for the harshest applications. We ensure the precision and reliability that aerospace and defense applications demand are met across the board.
Analog
Perfect for precision applications, including signal processing for aerospace and new space applications.
Power Management
Efficient solutions for applications that require optimized energy usage, like PMICs for embedded systems and automotive power regulation.
Mixed-Signal
Integrating analog and digital components for high-performance systems.
Radio Frequency (RF)
Optimized for radio frequency applications such as satellite communications, radar systems, and wireless technologies.
Sensors
Advanced sensor interfaces that cater to space applications with a focus on low-power, high-accuracy performance.
MRAM
A hi-rel memory solution for A&D and space applications due to its non-volatility, radiation tolerance, high endurance, and fast access speeds.
Multi-Project Wafer (MPW) – Reduced Development Costs
MPW programs allow you to reduce development costs significantly by sharing wafer space with other customers.Â
This shared-fabrication process provides the flexibility of low-volume production while minimizing upfront costs – making it easier for companies to prototype and test designs before moving to larger production runs.
Vertical Integration
Spirit offers end-to-end ASIC services.
- Design
- Foundry
- Wafer probe & binning
- Wafer processing
- Package design
- Assembly
- Electrical & radiation testing
- Screening & qualification
- Device analysis – DPA & FA
- Delivery of space-grade product
Made in the USA
All design, production, test, assembly and logistics are performed completely by our U.S. teams. We can handle ITAR requirements and regulations.
FPGA to ASIC Conversions
Applications
- Aerospace
- Defense
- Industrial
- Automotive
- Medical
- Security
Device Types:
- Sensors
- RF Devices
- Motion Control Devices
- Instrumentation / Avionics
- RFID
- Monitoring Systems
- Measurement & Control
Spirit Program Benefits
Increased Efficiency
Cost Control
Schedule Control
Leverage Buying
No EOL or Obsolescence
Competitive Advantages