Spirit Electronics is featured in an article about high-performance, radiation tolerant electronics for space in this month’s issue of Military & Aerospace Electronics magazine. Editor John Keller explores options for balancing costs, capability, size, weight and power consumption for new
Focused ion beam or FIB failure analysis services provide surgical precision when performing microelectronics root analysis. The final step in the majority of integrated circuit failure analysis projects involves deprocessing the device, removing layers of metal and oxide to expose
TI’s TPSM53604 is a 36-V, 4-A step-down power module shrinks solution size by 30% and delivers excellent thermal performance. Thermal performance is an important aspect of any power converter design. TI’s new power module solves the thermal design challenge by integrating