iMAPS 22nd International Conference & Exhibition on Device Packaging
March 2-5, 2026
Booth 611
The Most Comprehensive technical program and exhibition for microelectronics and Advanced Packaging.
Special Event at iMAPS DPC 2026:
Spirit Manufacturing & Innovations Demo
March 4, 2026
3:30pm – 5:30pm
Quail Ballroom
Join us for appetizers, drinks, drone racing, and demonstrations of our advanced packaging capabilities, including:
- 2.5D & 3D Packaging
- Chip on Board (COB)
- System-in-Package (SiP)
- Near Hermetic Sealing
- And more!
More Events Coming Soon!
We’re currently reviewing upcoming trade shows and evaluating which events we’ll be attending in the year ahead. Stay tuned for updates—we look forward to sharing where you can connect with the Spirit Electronics team next!