Wafer Processing
Wafer Dicing, Inspection, and Die Sort
with Precision, High-Yield Results
Our world-class DISCO automatic dicing systems process 300mm wafers across diverse materials—silicon, MEMS, GaN, GaAs, glass, and more. The complete processing suite includes backgrind, polish, first and second optical AOI, and automated pick-and-place into your preferred packaging. Wafer probe services available upon request. Blade specifications are tailored to each substrate’s material and thickness for optimal results.
Features & Capabilities
Wafer Processing Overview
Complete wafer handling capabilities including back grinding, backside inspection, polishing, handling, and precision dicing for Silicon, Sapphire, and Quartz in tape/reel, gel pack, and waffle pack options.
Wafer Dicing
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Max. Workpiece Size
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Φ300 mm / 12" diameter (round or square)
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Wafer/Substrate Materials*
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Silicon, Glass, Quartz, Laminate, Ceramic, Sapphire, Panels
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X-axis
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Cutting range
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310 mm
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Cutting speed
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0.1 ～ 1,000 mm/s
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Y-axis
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Cutting range
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310 mm
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Index step
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0.0001 mm
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Index positioning accuracy
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0.002/310 mm
(Single error) 0.002/5 mm |
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Z-axis
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Max. stroke
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31.2 mm
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Moving resolution
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0.0000002 mm (0.2 nm)
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Repeatability accuracy
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0.001 mm
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θ-axis
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Max. rotating angle
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320°
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*Contact Spirit to discuss our dicing capabilities for materials and substrates not listed.
Inspection
Visual die inspection identifies and removes all mechanical defects from post-fabrication processes before shipment, meeting MIL-STD-883 (Class B or Class S) standards. Using AOI (automated optical inspection) or high-magnification microscopes, we detect chip-outs, cracks, passivation voids, surface scratches, metal bridging, embedded foreign material, and contamination to ensure only defect-free die are delivered.
- MIL-STD-883 (Class B or Class S)
- AOI (automated optical inspection) and manual visual using high magnification microscopes
- Customer-specific requirements
Die Sorting
Full die sorting and pick-and-place capabilities with Automated Optical Inspection (AOI), wafer test capabilities, speed/temperature binning, “in family” data segregation, and Known Good Die verification for optimal yield.
- Diced wafers can be shipped on wafer frame, or sorted into waffle pack or Gel-Pak.
Discuss Your Project with Spirit's Technical Team
Spirit can provide complete process development from prototyping through launch. Contact our seasoned team of engineers to discuss your next project.