Spirit Electronics offers Fourier Transform InfraRed spectroscopy, or FTIR services when performing root cause analysis on the failure of an electronic component. What is Fourier Transform Infrared? Fourier Transform Infrared analysis, also commonly referred to as FTIR Spectroscopy,  is a

Semiconductor Failure Analysis – Enhancing Reliability Semiconductor failure analysis occupies a prominent position among high-tech fabricators. Even the most sophisticated ICs fail, and when they do, it’s critical that engineers and fabricators discover the root causes of the failure, so

Every IC defects and failures analysis project is unique; rarely, if ever, will an analyst come across a defect that is exactly identical to one found on a previous project. The wide range of process types, device applications, and conditions

Energy Dispersive Spectroscopy is like getting a fingerprint on your electronic component failure root cause. So you’re having a problem with a printed circuit board assembly (PCBA). You’ve done all you can to narrow down the failure site, but you’re

Microelectronics X-Ray imaging allows an analyst to see the inner workings of a device without disturbing its physical integrity. What is Microelectronics X-Ray Imaging Most modern electronic devices are packaged as proverbial “black boxes.” It is nearly impossible to tell

In this post, you will learn how an electronics failure analysis lab uses a FIB for Wafer Lot Acceptance during design verification. In the current era of System-on-Chip (SoC) designs with 10 and 11 metal layers, copper metallizations, exotic dielectric materials, and

IC decapsulation is the half art, half science process of breaking into integrated circuits to discover what defects might lie within. IC Decapsulation Reveals Hidden Secrets In their final, packaged form, many of the secrets of integrated circuits are concealed

Electron microscopy services can provide key data for many types of intellectual property (IP) analysis including patent research, reverse engineering, and microelectronics IP infringement analysis, to name just a few. This post explores how electron microscopy supports electronics intellectual property analysis.

Analogy Time Consider something like automobile production in the United States. It stands at about 12,000,000 cars per year. If 99.9% came off the assembly line in perfect condition and ready-to-drive that would look pretty good on paper. Except, perhaps,

Focused ion beam or FIB failure analysis services provide surgical precision when performing microelectronics root analysis. The final step in the majority of integrated circuit failure analysis projects involves deprocessing the device, removing layers of metal and oxide to expose