Technical Datasheets
Test & Inspection and Failure Analysis Datasheet
By using Environmental Life Testing and Test and Inspection in conjunction with a Test Early-Test Often approach in the product development cycle, weaknesses in the design are found early, before too much value is added to the part.
Wafer Dicing, Inspection and Sorting Datasheet
Depending on the substrate material and thickness, we use different dicing blade thicknesses and materials to saw wafers. Our dicing services include wafer inspection and die sorting if required. Diced wafers can be shipped on the tape hoop, or sorted into waffle pack or Gel-Pak.
Die Attach Datasheet
The die attach capabilities and expertise at SMART Microsystems support the process development, testing, and manufacturing of sub-assemblies designed by our customers allowing them to quickly realize a microelectronic package assembly solution for their products.
Wire Bonding Datasheet
The core wire bonding capabilities and expertise at SMART Microsystems support process development, testing, and manufacturing of sub-assemblies designed by our customers. Wire bonding processes are flexible and robust, allowing our customers to quickly realize a microelectronic package assembly solution for their products.
Encapsulation and Dispensing Datasheet
The encapsulation capabilities and expertise at SMART Microsystems support the process development, testing, and manufacturing of sub-assemblies designed by our customers allowing them to quickly realize a microelectronic package assembly solution for their products.
Reliability and Environmental Life Test Datasheet
SMART Microsystems’ environmental life testing identifies reliability issues early in your product development. Our contract testing laboratory works directly with you to provide testing solutions that help ensure product quality and reliability.
Discuss Your Project with Spirit's Technical Team
Spirit can provide complete process development from prototyping through launch. Contact our seasoned team of engineers to discuss your next project.